Computex 2026: Micron Powers AI Everywhere
StorageNewsletter, Tuesday, June 9th, 2026
At Computex 2026, Micron showcased AI-optimized memory and storage spanning data center and edge devices.
At Computex 2026, Micron presented a broad portfolio of AI-optimized memory and storage products, noting AI context lengths are growing 30x per year while per-server memory content has doubled in three years.
Data center advances include HBM4 36GB memory delivering 2.6x higher LLM inference throughput, a 256GB SOCAMM2 low-power module, and 9,200 MT/s DDR5 RDIMMs that are 40% faster with lower power. For the edge, Micron introduced LPCAMM2 modules for PCs, GDDR7 with 1.5 TB/s bandwidth, and client SSDs that load LLMs in under a second. The company is also expanding manufacturing across the US, India, Japan, Singapore, and Taiwan.