Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio With Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure
SuperMicro, Wednesday, July 15th, 2026
Supermicro expanded its DCBBS liquid cooling line with ten Rear Door Heat Exchanger models spanning 10kW to 120kW per door.
Supermicro expanded its Data Center Building Block Solutions liquid cooling portfolio with a ten-model Rear Door Heat Exchanger range aimed at high-density AI and HPC infrastructure.
The models cover cooling capacities from 10kW up to 120kW at the door level, with a maximum of 240kW at rack level, scaling from single systems to rack-scale AI factories.
They are compatible with standard EIA, ORv3 and MGX racks, giving operators an easy-to-deploy path to liquid cooling in both new builds and legacy facilities.
The RDHx units can serve as a primary liquid cooling solution or be combined with Supermicro Direct-to-Chip cooling as part of a complete DCBBS deployment.